Other Reactive Ion Etching Plasma

Designed for semiconductor plasma etching processes.

Enquire now

Call our global sales and customer support team on +44 (0) 2380 667 486 for more information.

Sorry no images at present

Features and benefits

1 year warranty

High efficiency

High quality

Outstanding reliability

Information

Machine Model

Reactive Ion Etching Plasma

Manufacturer

Other

Key Features

1 year warranty, High efficiency, High quality, Outstanding reliability

Description:

Designed for semiconductor plasma etching processes. Can be etched up to several hundred microns thick ion layer, resulting in high-speed and vertical etching.

G. System Specifications

Technical Data

Specification

Chamber effective size

13 x 13" (WD); Rotary table: Ø300mm

Power

600W @ 13.56MHz

Machine dimensions

1050 x 770 x 1620mm (WHD)

Vacuum pump mechanical

47CFM

Vacuum pump dry air flow requirements

0 ~ 60L/min

View all Plasma machines

For further information about our range of Plasma machines, or parts available on these products call us on +44 (0) 2380 667 486