Dynetech Vacuum plasma treatment system SPV-100
SPV-100 vacuum plasma cleaning machine is suitable for mass production and scientific research. It is widely used in the surface treatment of chips, camera modules, PCB, FPC, wafers and other products. It can effectively remove oily dirt and organic pollutant particles on the surface and improve surface adhesion. , the reliability and durability of the coating, improve the packaging stability.
Call our global sales and customer support team on +44 (0) 2380 667 486 for more information.
Features and benefits

1 year warranty

Can be customised

Easy operation

High efficiency
Information
Description:
Military-grade welding process, strong cavity sealing, and high-density plasma source ensure uniform cleaning in all directions;
One-key start, precise control of important parameters such as test time, vacuum degree, power, etc.;
The ultra-low cleaning temperature of 45°C does</span><span style="font-family:SimHei;"> not cause thermal influence and ensures stable treatment effect;
Dual or multi-channel process gas, gas control is stable.
Plasma surface treatment is to ionize the gas into plasma by applying sufficient energy to it. The "active" components of plasma include: ions, electrons, atoms, active genes, etc. Plasma treatment is to use the properties of these active components to treat the surface of the sample, so as to achieve cleaning, modification, etching and other purposes.
Specifications can be customised to suit your requirements, contact us now to discuss your needs.
G. System Specifications
