CCD High-Frequency Electromagnetic Bonding Machine
This equipment can control the inner core layer in turn, the target SPC expansion and contraction value, and adopts the MES system online operation mode.
Eight-Axis Riveting Machine
Adjust the riveting position for one-direction movement ( same as inner layer punching machine, automatically control the position of rivet)
PIN High-Frequency Bonding Machine
PIN Positioning, double table top/lower, high production capacity, easy to operation
Semi-automatic CCD high-frequency bonding machine
The equipment adopts automatic operation mode, which greatly shortens the labor and improves the accuracy requirements