Setsense Automatic Vertical High Vacuum Plugging Machine for IC-Substrate

Designed for carrier plate factories, it adopts automated linkage and contactless production technology to ensure quality stability and equipment reliability during the production process.

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Call our global sales and customer support team on +44 (0) 2380 667 486 for more information.

Features and benefits

1 year warranty

Easy operation

High accuracy

High efficiency

High quality

Information

Machine Model

Automatic Vertical High Vacuum Plugging Machine for IC-Substrate

Manufacturer

Setsense

Key Features

1 year warranty, Easy operation, High accuracy, High efficiency, High quality

Description:

Non-contact CORE layer via filling.

PARTICLE-FREE Industrial Design.

Dual-Mode Workstation with Manual/Automatic Switching.

R&D for FC-BGA and High Aspect Ratio ATE.

Industry-first automated hole plugging equipment improves productivity and work efficiency.

By optimising processes, energy and raw material consumption is saved and sustainable development is achieved.

Ensures consistent product quality and intelligent production.

G. System Specifications

Technical Data

Specification

Panel thickness

0.2-8.0mm

Panel Size

MIN:510*510mm MAX:510*635mm

Aspect Ratio

Through hole: 40:1 (Max.) Blind hole: 1:1 (Max., hole size after plating)

Plugging speed

2-80mm/sec (adjustable)

Plugging Hole Pressure

0-6kgf (adjustable)

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For further information about our range of Equipment, or parts available on these products call us on +44 (0) 2380 667 486