Other Inductively Coupled Plasma
Designed for high-etching semiconductor processing.
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Features and benefits

1 year warranty

High efficiency

High quality

Outstanding reliability
Information
Machine Model
Inductively Coupled Plasma
Manufacturer
Other
Key Features
1 year warranty, High efficiency, High quality, Outstanding reliability
Description:
Designed for high-etching semiconductor processing. The high plasma density can be adapted to a variety of plasma etching applications.
G. System SpecificationsTechnical Data
Specification
Chamber effective size
Rotary table: Ø360mm; Wafer capacity of 1200 tablets
Power
1000W @ 13.56MHz
Machine dimensions
1050 x 1620 x 770mm (WHD)
Vacuum pump mechanical
47CFM
Vacuum pump dry air flow requirements
0 ~ 60L/min
