Other Inductively Coupled Plasma

Designed for high-etching semiconductor processing.

Call our global sales and customer support team on +44 (0) 2380 667 486 for more information.

Features and benefits

1 year warranty

High efficiency

High quality

Outstanding reliability

Information

Machine Model
Inductively Coupled Plasma
Manufacturer
Other
Key Features
1 year warranty, High efficiency, High quality, Outstanding reliability

Description:

Designed for high-etching semiconductor processing. The high plasma density can be adapted to a variety of plasma etching applications.

G. System Specifications
Technical Data
Specification
Chamber effective size
Rotary table: Ø360mm; Wafer capacity of 1200 tablets
Power
1000W @ 13.56MHz
Machine dimensions
1050 x 1620 x 770mm (WHD)
Vacuum pump mechanical
47CFM
Vacuum pump dry air flow requirements
0 ~ 60L/min
View all Plasma machines

For further information about our range of Plasma machines, or parts available on these products call us on +44 (0) 2380 667 486

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