Setsense Semi-automatic High Vertical Vacuum Plugging Machine for IC-Substrate

Designed for high aspect ratio IC-Substrate PCB with conductive and non-conductive paste by vacuum. Focus on IC-Substrate plugging，achieves high quality production on IC-Substrate PCB. It is the first equipment for the customer in the IC-Substrate PCB industry

Call our global sales and customer support team on +44 (0) 2380 667 486 for more information.

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Features and benefits

1 year warranty

Can be customised

High accuracy

High efficiency

High quality

Information

Machine Model

Semi-automatic High Vertical Vacuum Plugging Machine for IC-Substrate

Manufacturer

Setsense

Key Features

1 year warranty, Can be customised, High accuracy, High efficiency, High quality

Description:

The Industry's first high-vacuum hole plugging model. There is no need to rely on fixtures and air guides for hole

plugging, and the intelligent operator interface makes the operation process more user-friendly and easy to operate.

Meet the requirements of high density holes, completely solve the bubble problem of circuit boards.

Automatic paste supply system enables paste change without stopping.

Automatic paste system improves quality after plug hole scraping.

G. System Specifications

Technical Data

Specification

Panel thickness

0.2-8.0mm

Panel Size

MAX: 610*762mm MIN: 250*250mm

Aspect Ratio

Through hole: 70:1 (Max. after plating) Blind hole: 1:1 (Max. after plating)

Plugging speed

2-80mm/sec (adjustable)

Plugging Hole Pressure

0-6kgf (adjustable)

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For further information about our range of Equipment, or parts available on these products call us on +44 (0) 2380 667 486

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