Setsense Vertical Vacuum Plugging Machine
Specially developed and designed for ultra-high aspect ratio characteristic boards, using the vacuum principle to realise the conductive and non-conductive resin paste hole plugging process, suitable for the whole board plugging process of multiple types of holes on the same board surface, and can be applied to resins, silver paste, copper paste and conductive adhesives and other materials
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Features and benefits

Can be customised

Easy operation

High accuracy

High efficiency

High quality
Information
Description:
Can be produce the high aspect ratio panels( 70: 1 ). High vacuum up to ≤ 30pa.
Flexibility to realise: through holes, blind holes on one or both sides, back drilled holes, etc. on the same panel surfa.
Ideal for small quantities and a wide range of gauges, no fixture tools or air guides are required for hole plugging.
The operating interface is automated, user-friendly and easy to operate.
G. System Specifications