Automatic Vertical High Vacuum Plugging Machine for IC-Substrate
Designed for carrier plate factories, it adopts automated linkage and contactless production technology to ensure quality stability and equipment reliability during the production process.
Semi-automatic High Vertical Vacuum Plugging Machine for IC-Substrate
Designed for high aspect ratio IC-Substrate PCB with conductive and non-conductive paste by vacuum. Focus on IC-Substrate plugging,achieves high quality production on IC-Substrate PCB. It is the first equipment for the customer in the IC-Substrate PCB industry
Vertical Vacuum Plugging Machine
Specially developed and designed for ultra-high aspect ratio characteristic boards, using the vacuum principle to realise the conductive and non-conductive resin paste hole plugging process, suitable for the whole board plugging process of multiple types of holes on the same board surface, and can be applied to resins, silver paste, copper paste and conductive adhesives and other materials
Vertical Vacuum Plugging Machine
Specially developed and designed for ultra-high aspect ratio characteristic boards, using the vacuum principle to realise the conductive and non-conductive resin paste hole plugging process, suitable for the whole board plugging process of multiple types of holes on the same board surface, and can be applied to resins, silver paste, copper paste and conductive adhesives and other
Vertical Vacuum Plugging Machine
Specifically designed for the development of oversized circuit boards; the use of vacuum principles to achieve conductive and non-conductive resin paste hole plugging process, suitable for a variety of types of holes plugging process for the entire panel, and can be applied to resin, silver paste, copper paste and conductive adhesive and other materials.
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