Laminating and Bonding equipment that promise high quality and dependability
Exacting standards that deliver exact results
Manufactured to exacting standards, our Laminating and Bonding equipment solutions cover a wide range of applications. From pressing flexible printed PCBs to laminating a variety of materials, and using a variety of processes, high quality and dependability are hallmarks of our lamination and bonding equipment range.
Bonding press The MP 50 Series
The maximum usefull area of 560 x 500 mm gives enough capacity for small series and protopype production. The complete range of handling & tools is also available for this line.
Bonding press The LP 100 series
The standard package goes up to 300° C process temp. Higher heating capacity and other hydraulics are available
Bonding press The LP 1000 series
This Systems are in ALU Version ( Automatic Loading / Unloading ) which shows a maximum capacity and efficence at a low need of floor capacity.This system came all at 300° C maximum heat capacity.
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